Log In   |  Register Free Newsletter Subscription
Skip navigation
Zibb
Subscribe to Multichannel News
Email
Print
Reprints/License
RSS

TI Touts Chips for CableLabs DOCSIS 3.0 Testing

Cable Modem, CMTS Vendors to Submit Products for Certification Testing This Week

By Todd Spangler -- Multichannel News, 10/2/2007 7:04:00 AM MT

Texas Instruments said several cable modem and cable-modem termination system vendors that are using its Puma 5 family of Data Over Cable Service Interface Specification 3.0 chip sets have submitted products for CableLabs’ DOCSIS 3.0 testing in Certification Wave 56 starting this week.

The company declined to identify which of its customers for the Puma 5 silicon are participating in the certification wave.

TI’s customers for DOCSIS chips include Motorola and Arris Group. Meanwhile, Cisco Systems and TI have already tested interoperability of their DOCSIS 3.0 equipment bonding two upstream channels, which marked the first time such upstream-bonding features have been verified as interoperable, according to the companies.

Among other features, DOCSIS 3.0 offers the ability to virtually bond together multiple quadrature amplitude modulation (QAM) downstream channels to act as if they were a single connection, boosting bandwidth to 160 Mbps or higher.

Comcast CEO Brian Roberts last month said the operator expects to begin offering services based on DOCSIS 3.0 (a.k.a. “wideband”) technology next year.

Email
Print
Reprints/License
RSS
Talkback
Related Content
More >>>

Reed Business Information Resource Center

Featured Company


Most Recent Resources

Advertisement

Related Microsite Content

Related Links

free marketing module graphic
Advertisement
Multichannel Subscription
NEWSLETTERS
Multichannel Newswire
HD Update
Cable Technology
VOD Newsletter
Hispanic TV Update
HD Programming
Multicultural Newsletter
B&C NewsCentral
Television Careers



Please read our Privacy Policy

About Us   |   Advertising Info   |   Site Map   |   Contact Us   |   Subscription   |   Affiliate Links   |   RSS
© 2009 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites