Mobile World Congress: News Briefs IINews From Verizon, Ericsson, Cisco, Expway, Ovum 2/24/2016 10:30 AM Eastern
Here’s another batch of news briefs from this week’s Mobile World Congress show in Barcelona. Go here to check out our first roun of briefs.
-Verizon said it has opened the door to thousands of developers to ThingSpace, its Internet of Things platform. Verizon said more than 4,000 developers are using ThingSpace since its launch in October 2015. Noting its global ambitions, Verizon said its IoT footprint now spans more than 120 countries, and expects to raise that total to nearly 200 by year-end. Verizon also said cloud APIs for ThingSpace will soon be available in beta form
-On the heels of a business and tech partnership forged last year, Ericsson and Cisco said they’ve been selected to transform Vodafone’s Portugal IP mobile backhaul platform. The system will feature Cisco Aggregation Services Router 9000 and Ericsson systems integration and global services.
-Expway, a wireless multicast company, introduced FastLane, a content delivery network solution optimized for mobile networks.FastLane, it said, optimizes the link from the network cell to devices using LTE Broadcast, Multicast Dynamic Switching and pre-emptive caching. At the show, Expway is running demos with Akamai and Huawei. Expway also announced that MediaTek will integrate the Expway middlware on its “helio” smartphone SoC family.
-Ovum issued a forecast that the number of m-commerce users worldwide will grow from 452.78 million in 2014, to 2.07 billion in 2019 amid the surge in adoption of person-to-person mobile transfer and mobile proximity payment technologies and the use of powerful smartphones with larger screens. The firm also expects the global transaction value of m-commerce to grow from $50.92 billion in 2014, to $693.36 billion in 2019.
-Chipmaker Marvell is showing a suite of silicon and software for the Internet of Things, wireless and smart home ecosystems, including demos running on Google Weave and Brillo and advancements in its Kinoma suite of products, modular virtual system on chips, and its Andromeda Box platform, which is made for Brillo.