Indicating the progress being made on cable’s new multi-gigabit platform for HFC, Technicolor said it will show off a DOCSIS 3.1-based device called the MediaAccess TC4400 at next week’s INTX event in Chicago.
Technicolor (booth 2123), said the device is “currently in lab testing with major cable providers.”
The first wave of D3.1 modems will be hybrids that support and combine DOCSIS 3.0-based based on the bonding of multiple 6MHz-wide or 8MHz-wide channels, and a new portion of DOCSIS 3.1-based spectrum that uses blocks of OFDM-based subcarriers. The minimum configuration set by the CableLabs specs calls for those devices to handle a minimum of 24 bonded downstream and eight upstream single-carrier QAM channels (on the D3.0 side), and two 192-MHz wide OFDM blocks in the downstream, and two 96 MHz-wide OFDM blocks in the upstream (on the D3.1 side).
That configuration, which Technicolor will show, will be capable of 5 Gbit/s down and up to 1 Gbps upstream when fully utilized. The CableLabs D3.1 platform is targeting capacities of up to 10 Gbps down and as much as 2 Gbps upstream.
Broadcom, STMicroelectronics and Intel/Max Linear are among the known chipmakers that are developing D3.1 cable modem silicon.
An update on DOCSIS 3.1 development will be featured in a special technology section in the May 4 edition of Multichannel News.
As for Technicolor, it will also launch an update of its Wi-Fi Doctor diagnostic and configuration platform for network service provider installers.
It will also show the MediaPlay SLIM Ultra HD OTT Ultra-Thin set-top box, which features dual band 2x2 802.11ac Wi-Fi, integrated HEVC decoding, and MHL 2.0, enabling a “single wire connection” for live TV, VoD, and web-sourced content.
Also on the 4K front, Technicolor will show a new Ultra HD, high-frame rate (p60) High Dynamic Range (HDR) set-top box that aims to support a greater color palette and better and brighter pixels (redder reds, blacker blacks, etc.) than what’s been seen in current 4K technology.